Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics

LIAN Peng-fei; SONG Jin-liang; LEI Shi-wen; TAO Ze-chao; ZHAO Hong-chao; ZHANG Jun-peng; LIU Zhan-jun

doi:10.1016/S1872-5805(18)60344-0

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Article Navigation > New Carbon Mater. > 2018 > 33(4): 351-356

LIAN Peng-fei, SONG Jin-liang, LEI Shi-wen, TAO Ze-chao, ZHAO Hong-chao, ZHANG Jun-peng, LIU Zhan-jun. Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics. New Carbon Mater., 2018, 33(4): 351-356. doi: 10.1016/S1872-5805(18)60344-0

Citation:

LIAN Peng-fei, SONG Jin-liang, LEI Shi-wen, TAO Ze-chao, ZHAO Hong-chao, ZHANG Jun-peng, LIU Zhan-jun. Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics. New Carbon Mater., 2018, 33(4): 351-356. doi: 10.1016/S1872-5805(18)60344-0

Citation:

LIAN Peng-fei, SONG Jin-liang, LEI Shi-wen, TAO Ze-chao, ZHAO Hong-chao, ZHANG Jun-peng, LIU Zhan-jun. Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics. New Carbon Mater., 2018, 33(4): 351-356. doi: 10.1016/S1872-5805(18)60344-0

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Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics

doi: 10.1016/S1872-5805(18)60344-0

1.
Key Laboratory of Carbon Materials, Institute of Coal Chemistry, Chinese Academy of Sciences, Taiyuan 030001, China;
2.
Key Laboratory of Nuclear Radiation and Nuclear Energy Technology, Shanghai Institute of Applied Physics, Chinese Academy of Sciences, Shanghai 201800, China

Funds: Natural Science Foundation of Shanghai (16ZR1443400); National Natural Science Foundation of China (51602336, 21576277, 51602335); Youth Innovation Promotion Association CAS (2017205).

Received Date: 2018-06-03
Accepted Date: 2018-08-30
Rev Recd Date: 2018-07-28
Publish Date: 2018-08-28

Abstract

Abstract

Two mesophase pitch-based graphite foams with densities of 0.62±0.01 (GF1) and 0.84±0.01 g/cm³ (GF2) were prepared by foaming the pitch in an autoclave at 723 K, 6.0 MPa and 763 K, 13.4 MPa, respectively, followed by carbonization at 1273 K for 2 h and graphitization at 2973 K for 0.5 h. The GFs were infiltrated by a Sn-Bi liquid to prepare GF/Sn-Bi alloy composites for use as thermal sinks for electronics. The microstructures and thermophysical properties of the composites were investigated. Results indicated that GF1 had a larger cells and thinner cell walls than GF2. The Sn-Bi liquid was well infiltrated into cells of the GFs, resulting in composites with densities of 5.60±0.01 and 3.83±0.01 g/cm³ for GF1 and GF2, respectively. The thermal diffusivity and coefficient of thermal expansion (CTE) of the GF1/Sn-Bi composite were 51.6±2 mm²/s and 16.6±0.02 ppm/K, respectively. The corresponding values for the GF2/Sn-Bi were 163.1±3 mm²/s and 8.08±0.02 ppm/K. The GF2/Sn-Bi composite had a high thermal diffusivity and a low CTE value matching that of semiconductor chips and packaging materials.
- Mesophase pitch-based graphite foam,
- Sn-Bi alloy,
- High thermal conductivity,
- Low coefficient of thermal expansion

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References(14)

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