WAN Jun, MA Zhi-bin, CAO Hong, WU Zhen-hui, WANG Jian-hua. Preparation of SiCN crystals using microwave plasma CVD assisted by pulsed nitrogen ion beam sputtering. New Carbon Mater., 2010, 25(01): 48-52.
Citation:
WAN Jun, MA Zhi-bin, CAO Hong, WU Zhen-hui, WANG Jian-hua. Preparation of SiCN crystals using microwave plasma CVD assisted by pulsed nitrogen ion beam sputtering. New Carbon Mater., 2010, 25(01): 48-52.
WAN Jun, MA Zhi-bin, CAO Hong, WU Zhen-hui, WANG Jian-hua. Preparation of SiCN crystals using microwave plasma CVD assisted by pulsed nitrogen ion beam sputtering. New Carbon Mater., 2010, 25(01): 48-52.
Citation:
WAN Jun, MA Zhi-bin, CAO Hong, WU Zhen-hui, WANG Jian-hua. Preparation of SiCN crystals using microwave plasma CVD assisted by pulsed nitrogen ion beam sputtering. New Carbon Mater., 2010, 25(01): 48-52.
School of Material Science and Engineering, Wuhan Institute of Technology, Key Laboratory of Plasma Chemical and Advanced Materials of Hubei Province, Wuhan 430073, China
Funds:
Supported by Nature Science Foundation of Hubei province (2005ABA023).
Crystalline silicon carbon nitrides were synthesized on quartz glass substrates by microwave plasma chemical vapor deposition, using precursors produced from a pulsed nitrogen ion beam sputtering dicyandiamide target. The effects of deposition temperature on the morphology, composition and structure of the samples were investigated by scanning electron microscopy, energy dispersive X-ray, X-ray diffraction and X-ray photoelectron spectroscopy. It is found that the surface morphologies of the deposits change from well crystallized hexagonal crystals at 800 ℃ to semi-developed multi-sheet crystals at 700 ℃ and to an amorphous solid with small grains at 550 ℃. The intensity of the diffraction peaks decreases and the values of the cell parameters a and c increase with the deposition temperature. The as-prepared crystalline films are silicon carbonitride with the crystalline structure of Si3N4 modified by replacing some of the Si atoms with C atoms. The N atoms are mainly bonded to Si, and C atoms are in the form of sp3C—N, sp2C=N and sp2C=C bonds. Decreasing deposition temperature favors an increase of C atom content and sp3C—N bond fraction.