Abstract: As the temperature of electronic devices continues to rise, the quest for high-efficiency heat dissipation has emerged as a critical concern, particularly when it comes to ensuring device performance and longevity. A high thermal conductivity is usually dependent on the ability of fillers to provide thermal conduction channels within composites. In recent years, the development of three-dimensional (3D) interconnected structures using high thermal conductivity fillers in composites has emerged as a promising approach. Compared to the traditional isotropic distribution and directional arrangements, 3D interconnected filler structures improve the thermal conductivity. We review research progress on metal matrix composites with a 3D interconnected carbon filler that have a high thermal conductivity. The thermal conductivity mechanisms and models of composites are elaborated, and important factors relevant to improving the thermal conductivity are considered. Ways of constructing 3D interconnected carbon networks and their effects on the thermal conductivity of their composites should serve as a reference for the advancement of high-performance metal matrix thermal conductivity composites.