Abstract: The use of carbon nanotubes(CNTs) as conducting wires instead of copper wires for integrated circuits and very large scale integration has become more and more important as their sizes are being scaled down and quantum effects become evident owing to their one-dimensional structure, excellent electrical, thermal and mechanical properties.Interconnect technologies for CNTs have become an important research activity in recent years and the latest research progress is summarized.Methods include localized nanoscale chemical vapor deposition, electron, ion and laser beam irradiations, atom force microscopy using field-induced evaporation and anodic oxidation, and dip-pen nanolithography in the AFM using dynamic exchange between tapping and lifting.