石墨烯/泡孔氧化铝/环氧树脂复合材料导热性能

Preparation and properties of graphene-epoxy/alumina foam composites

  • 摘要: 以环氧树脂为代表的高分子聚合物在电子设备、电子封装和航空航天领域中有着广泛的用途,但环氧树脂极低的热导率限制了其应用。本文以泡沫氧化铝为骨架,在其表面负载氧化石墨烯,600~1 000℃温度下,对氧化石墨烯进行热还原,制备不同浓度的石墨烯负载的泡沫氧化铝,进一步与环氧树脂复合,得到复合材料。对泡沫氧化铝陶瓷所负载的石墨烯进行了XRD、Raman、SEM表征,对复合材料的热导率和电导率进行了测试。结果表明:热还原温度越高,氧化铝泡孔表面的氧化石墨烯被还原越充分。由于泡孔氧化铝的互相联通的管道,提供了声子传输的通道,0.533%负载量石墨烯就可以使复合材料的热导率达到了2.11 W/m·K,电导率达到了45 S/m。

     

    Abstract: Graphene-epoxy/alumina foam composites were prepared by repeated impregnation of alumina foam with a graphene oxide (GO) suspension and drying, followed by annealing at 600 to 1 000℃ under an Ar atmosphere and infiltration of epoxy and crosslinking agents into the foam under vacuum. XRD, SEM and Raman spectroscopy were used to characterize the microstructures of the composites. Results indicated that the GO was reduced more thoroughly at a higher annealing temperature. The thermal and electrical conductivities of the composite reached 2.11 W/m·K and 45 S/m, respectively, with a GO content of 0.533 wt% when an annealing temperature of 1 000℃ was used. The graphene loaded on the surface of the alumina foam greatly increased the thermal and electrical conductivities of the composites while the alumina foam network contributed to the fast phonon transport, which favored heat transport.

     

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