三维互连炭材料/金属导热复合材料的研究进展

Recent advances in 3D interconnected carbon/metal high thermal conductivity composites

  • 摘要: 随着电子设备的产热不断攀升,在确保设备性能和寿命方面,高效散热已成为一个关键的技术问题,高的导热性通常取决于填料在复合材料中形成快速导热通道的能力。近年来,在复合材料中利用高导热性填料开发三维互连结构已成为一种很有前途的方法。与传统的均匀分布和定向排列相比,填料的三维互连结构显著提高了复合材料的热导率。本文综述了三维互连结构的炭材料增强金属基导热复合材料的研究进展,讨论了复合材料的导热机理和导热模型,分析了提高复合材料导热性能的关键因素。本文通过回顾这些独特的构建三维互连炭材料网络的形式及其对复合材料导热性能的影响,旨在为进一步开发高性能金属基导热复合材料提供参考。

     

    Abstract: As the temperature of electronic devices continues to rise, the quest for high-efficiency heat dissipation has emerged as a critical concern, particularly when it comes to ensuring device performance and longevity. A high thermal conductivity is usually dependent on the ability of fillers to provide thermal conduction channels within composites. In recent years, the development of three-dimensional (3D) interconnected structures using high thermal conductivity fillers in composites has emerged as a promising approach. Compared to the traditional isotropic distribution and directional arrangements, 3D interconnected filler structures improve the thermal conductivity. We review research progress on metal matrix composites with a 3D interconnected carbon filler that have a high thermal conductivity. The thermal conductivity mechanisms and models of composites are elaborated, and important factors relevant to improving the thermal conductivity are considered. Ways of constructing 3D interconnected carbon networks and their effects on the thermal conductivity of their composites should serve as a reference for the advancement of high-performance metal matrix thermal conductivity composites.

     

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